TECHNOMELT's hot melt polyamide materials serve the increasing demands for circuit board protection in the electronics market. TECHNOMELT's low pressure and high-speed molding process is suitable for the encapsulation of sensitive electronic components in high-volume manufacturing environments. The technology allows for unique design beyond the form, fit and function of traditional encapsulating materials.
The low pressure molding materials also deliver exceptional electrical insulation and excellent temperature, vibration and solvent resistance for a wide range of applications. TECHNOMELT also protects electronics from the harshest environmental conditions, including high humidity, long-term UV exposure and extreme thermal cycling.
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TECHNOMELT Product Range
No matter the requirement, Henkel has the right TECHNOMELT material for your application!