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Media and Downloads - Circuit Board Protection

We invite you to gain deeper insights into our TECHNOMELT portfolio by downloading exclusive content and watching videos on our circuit board protection technology.

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Process and Design Considerations

Low Pressure Molding Overview

Technical Article: Masking Alternative

TECHNOMELT AS 8998 Technology Overview

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Application Checklist

TECHNOMELT Application Checklist

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please fill out these application and requirements fields. A Henkel
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Technical Data Sheets

Technical Data Sheets

 

Safety Data Sheets

Safety Data Sheets (SDS/MSDS)

Safety precautions for handling and working with the TECHNOMELT materials

Technical Articles

Taking off the Mask: Peelable Electronics Masking Solution

A novel solution for circuit board protection

Material Studies

Impact of Low Pressure Molding on Solder Joints

Evaluate microstructural integrity of solder joints after low pressure molding

TECHNOMELT AS 8998 Auto-masking Dispense Study

Customer evaluation on consistency and repeatability of material dispense weights

TECHNOMELT AS 8998 Electrostatic Discharge (ESD) Test Report

Results for ESD sensitive items based on third-party testing

TECHNOMELT AS 8998 Masking Residue Study

Customer evaluation on residues after masking, comparing AS 8998 and UV-cured materials

TECHNOMELT AS 8998 Surface Insulation Resistance (SIR) Study

Residue testing after the material is removed from a circuit board

TECHNOMELT PA 668 Discoloration Study

Color stability and material testing within oxygen and nitrogen environments

TECHNOMELT PA 2692 Dwell Time Study

Color and mechanical properties stability testing within an oven at 240°C

Dielectric Constant and Dissipation Report

Third-party analysis of dielectric properties of TECHNOMELT materials

Handling Guidelines

Process and Design Considerations for TECHNOMELT

Thermal Guidelines for Hot Melt Thermoplastic Adhesive Resins

Drying Guidelines for TECHNOMELT Materials

Webinar Recordings

Low Pressure Molding

Encapsulation and Electronics Protection

Recorded live on: Wednesday, February 7, 2018

Technology Overviews

Low Pressure Molding Overview

Introduction to the low pressure molding technology,
process and product solutions

TECHNOMELT AS 8998 Technology Overview

Introduction to the benefits and cost savings of the peelable masking solution

Literature

Low Pressure Molding Solutions Brochure

TECHNOMELT AS 8998 Product Fact Sheet

TECHNOMELT PA 2384 Product Fact Sheet

TECHNOMELT PA 668 Product Fact Sheet

Press Releases

Henkel Expands Award-Winning TECHNOMELT Portfolio

New Henkel TECHNOMELT Material Tops Category to Win Global Technology Award

Henkel forms Partnership with LPMS USA to Broaden Customer Access to TECHNOMELT Low Pressure Molding Processes

Henkel Expands Partnership with Ellsworth Adhesives through New Moldman Systems LLC Equipment Division

New Technomelt® Material Streamlines Substrate Coating Processes

TECHNOMELT AS 8998 Masking Material Producing Measurable Gains in Efficiency, Cost Control; Recognized with Industry Award

Low Pressure Molding Video

TECHNOMELT requires only three simple steps to encapsulate a circuit board, compared to up to eight steps with traditional potting. See for yourself the process improvements and material benefits when using TECHNOMELT in your manufacturing process.

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TECHNOMELT Product Range

No matter the requirement, Henkel has the right TECHNOMELT material for your application!

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